Shape how Rockwell Automation builds electronics—one board at a time
Picture your day starting on the production floor in Mequon, walking a new SMT line start-up, then heading to New Berlin to finalize a capital plan for selective solder upgrades. In between, you’re advising a global site on solder-print optimization and reviewing design-for-assembly feedback with hardware engineers. That’s the rhythm of this role: hands-on problem solving, standard-setting leadership, and technology stewardship across Rockwell Automation’s global electronic assembly operations.
Based within our specialized Manufacturing Process Engineering – PCBA team, you’ll operate at the intersection of manufacturing excellence, technology roadmap ownership, process standardization, and advanced process analysis. You’ll report to the Manager of Manufacturing Process Engineering – PCBA and spend significant on-site time at our Mequon and New Berlin facilities while influencing sites worldwide.
Mission
Provide expert leadership in electronic assembly to elevate quality, reliability, and throughput—and deliver long-term profitability—through global standardization, strategic capital deployment, and technology innovation.
What you’ll own
- Technical depth: Maintain deep expertise in at least two electronic assembly domains such as Wave soldering, Selective soldering, Conformal coating, PCB panel singulation, SMT solder printing, SMT pick-and-place, SMT reflow, AOI, and equipment maintenance & troubleshooting.
- Standards leadership: Create, deploy, and sustain global process standards that reduce cost, improve quality, and increase throughput; author and maintain procedures, work instructions, and training materials; drive best-practice adoption across global facilities.
- Capital & technology: Lead equipment selection, business case development, purchasing, and implementation; manage capital projects from requirements through production release; benchmark emerging technologies via suppliers, conferences, and technical forums; assess facilities against standardized criteria.
- Data-driven optimization: Use DOE, control charts, and statistical analysis; monitor and report electronic assembly KPIs; apply Lean Six Sigma methodologies (DMAIC and DMADV) to drive continuous improvement.
- Design engagement: Partner with design on DFM/DFA; embed assembly considerations into Electronic Assembly Design Guidelines; share knowledge via presentations, documentation, and technical reviews.
Required qualifications
- Bachelor's degree in a relevant field.
- Significant on-site presence at Mequon and New Berlin, with global collaboration across Rockwell Automation facilities.
- Legal authorization to work in the U.S. We will not sponsor individuals for employment visas, now or in the future, for this job opening
Preferred qualifications
- Typically 8+ years of relevant experience.
- BS or MS in Mechanical, Electrical, or Industrial Engineering.
- 7–10+ years of hands-on electronic assembly manufacturing experience.
- Depth in solder profiling, SMT, post‑SMT, or conformal coat processes.
- Familiarity with IPC‑A‑610.
- Lean Six Sigma experience (Green Belt or higher preferred).
Tools and methods you know
- Bachelor's Degree
- 5 Why (Root Cause Analysis Method)
- ISO 22000
- Process Engineering
- Design for Assembly (DFA)
- Electrical / Electronic Systems
- Engineering Degree
- AS9100 Experience
If you thrive on building standards, scaling best practices globally, and extracting measurable improvements from complex assembly processes, you’ll feel right at home here.